For sputtering coatings, it can be simply understood as using electrons or high-energy lasers to bombard the target material, and the surface components are sputtered out in the form of radicals or ions, and finally deposited on the substrate surface, undergoing the film forming process, and finally forming a thin film .

The vacuum system and auxiliary coating system require a chiller to maintain a constant temperature. The vacuum system is calculated according to the power of the vacuum pump. The auxiliary system (electron gun, target stage, purge, plasma) can be matched at full power, and the H series chiller can be given priority.